Interdigital, Infineon Broaden 3G Agreement

Interdigital, Infineon Broaden 3G Agreement


The strategic partnership between two technology giants just got bigger. InterDigital Communications of the U.S. and Germany’s Infineon Technologies AG have announced the joint development of High Speed Downlink Packet Access 3G protocol stack software technology for the 3G platform being put forth by Infineon.

The HSDPA agreement is a further result of a four-year old corporate handshake aimed at developing and commercializing telecommunications technologies, specifically focusing on 3G, to a worldwide market.

“Infineon believes that by partnering with InterDigital in our 3G protocol stack development, we can more quickly bring a mature 3GPP Release 5 product to our customers, with committed HSDPA deliveries this quarter,” said Thomas Lindner, senior director of marketing at Infineon’s Mobile Software Business Unit. “We therefore are pleased to have expanded our joint 3G development with InterDigital to include HSDPA.”

InterDigital, based in King of Prussia, Penn., has pioneered the design, development, and delivery of advanced wireless technology platforms for more than 30 years. It also has technology development agreements with Nokia, NEC, Sharp, and Matsushita.

Infineon Technologies AG, based in Munich, Germany, is a spinoff of Siemens AG that came to life in 1999. It offers semiconductor and system solutions for automotive, industrial, and multimarket sectors. Among its products are memory products and communication applications.