Intel has confirmed the development of an ultra-low power version of its high-performance 65 nanometer logic manufacturing process. To be used in mobile devices such as mobile phones, PVPs and PDAs, the technology is expected to enhance the power back up capabilities of batteries in these devices. It will be the second manufacturing process from Intel which will be based on the 65 nanometer process technology.
Elaborating on the utility highpoints of the new power manufacturing process, Mooly Eden, VP, Intel, said “People typically embrace mobile platforms that maximize battery life. Such products will be greatly enhanced by our new ultra-low power manufacturing process. We will design future mobility platforms to take full advantage of both leading-edges, 65nm manufacturing processes.”
Leakage of electricity from microscopic transistors has been a major bottleneck in the attempt to reduce chip power consumption attached with mobile and battery-operated devices. But the company claims to have overcome this problem with its new manufacturing. Mark Bohr, senior fellow and director of Intel Process Architecture and Integration says, “Test chips made on Intel’s ultra-low power 65nm process technology have shown transistor leakage reduction roughly 1000 times from our standard process. This translates into significant power savings for people who will use devices based on this technology.”
The new process is slated to become commercially operational soon.