Nokia has announced their plans with Texas Instruments to incorporate a single-chip solution into future entry-level mobile phone designs to increase global market share.
The handsets based on TI’s Digital RF Processor (DRP) will be smaller, faster and offer more features at a lower price because of the integration of the digital baseband, SRAM, logic, RF, power management and analog functions.
See press release below.
Texas Instruments Delivers Industry’s First Integrated Single-Chip Solution for Mobile Phones; Nokia to Develop Mobile Phones Based on the Solution
Texas Instruments Incorporated and Nokia today announced the cooperation whereby Nokia will incorporate a single-chip solution based on TI’s Digital RF Processor (DRP) technology to its future mobile phones. The cooperation will allow Nokia to offer more cost-effective advanced handsets, especially in high-volume entry markets.
Today’s announcement fulfills a commitment TI made in 2002 when the company announced its intention to integrate the bulk of handset electronics on a single chip, including digital baseband, SRAM, logic, RF, power management and analog functions, and to sample the first product in 2004. The first version of the single-chip solution, which sampled in December 2004 and was developed through TI’s advanced 90nm CMOS manufacturing technology, targets the mass-market voice-centric marketplace.
By adopting TI’s DRP-based single-chip technology for its future mobile phones, Nokia intends to increase its proven innovation and leadership position in the marketplace. Cost, size, power and performance optimizations are crucial, especially for high-volume entry-level mobile phones. The combination of Nokia’s world-leading expertise in mobile devices with TI’s DRP based single-chip technology will take this optimization to a higher level. As a first step, Nokia phones based on the single-chip solution will target the entry-level mobile phone market, particularly in high-growth regions such as India and China.
Based on TI’s innovative DRP technology, the single-chip solution reinforces the company’s clear edge in integration, furthering TI’s and its customers’ competitive positions. This pioneering approach to wireless chip design applies digital technology to simplify radio frequency processing, which significantly reduces board space, extends battery life, and makes for a more cost-effective, powerful, versatile mobile phone. The world’s first GSM cellular phone call using TI’s DRP technology was made last February in TI’s labs, proving the technology.
“Over two years ago, TI announced its vision to integrate its DRP technology in our mobile system solutions,” said Gilles Delfassy, Senior Vice President, General Manager, Wireless Terminals Business Unit. “This vision was first put into action in a single-chip solution for Bluetooth connectivity, is now continued with the single-chip GPRS solution, and will be followed with a robust roadmap of single-chip products to address additional wireless needs. With the industry’s first integrated single-chip solution, TI and Nokia are bringing more affordable, advanced mobile phones to consumers worldwide.”
“TI´s advanced DRP technology, combined with our systems expertise, will enable us to deliver smaller, sleeker handsets with the latest voice, data, and multimedia capabilities without increasing size and power consumption,” said Juha Pinomaa, Vice President, Entry Business Line, Nokia. “By incorporating TI´s DRP technology into a single chip, future Nokia mobile phones will provide the ideal mix of cool features and cost-effectiveness, making them more attractive to the mass marketplace.”
This latest advancement joins TI´s already sophisticated and integrated DRP technology roadmap. The BRF6100 Bluetooth single chip, announced in June 2002, was the first implementation of TI´s DRP technology, followed by the BRF6150 and the BRF6300. TI´s integrated wireless technology roadmap also includes a single chip solution for digital TV for mobile phones, as well as future single chip solutions for GPS, wireless LAN, UMTS and other air interfaces, paving the way for further integration with the cellular modem and TI´s OMAP processors.