Texas Instruments has unveiled its third generation 802.11 chipset designed specifically for mobile devices. The TNETW1250 chipset will support 802.11b/g or 802.11a/b/g using TI’s WLAN RF solution. This chip is geared for use with the OMAP family of application processors, GSM, GPRS, CDMA and EDGE chipsets and single-chip Bluetooth solution. Having a Wi-Fi enabled handset will allow you to retrieve information, news, music, pictures, ringtones and what have you.
The size of the chip is very small (about 25% then any others) and will have little effect on power and battery life because of TI’s Enhanced Low Power (ELPTM) technology, in stand-by mode the chip may draw around 400 micro-Amperes of juice. Production of the chips will be mid-2004 and we can expect to see handsets using them as soon as the fall. Another reason to upgrade your phone, again. TI has also made the chip very affordable and should not raise the costs of handsets by much.
The TNETW1250 features on-chip power management, re-use of cellular clock frequencies, and low pin-count host interfaces to eliminate any barriers for integrating with GSM, GPRS, CDMA and EDGE chipsets. It will also support Voice over WLAN (VoWLAN) capability including QoS, WPA2 and Cisco Compatible Extensions support.