Toshiba’s New HDD Offers World’s Highest 2.5-inch Platter Capacity

Toshiba’s New HDD Offers World’s Highest 2.5-inch Platter Capacity


Toshiba Corporation today announced a superslim 60GB 2.5-inch hard disk drive that achieves the highest capacity of any drive in this key, fast growing form-factor. Making full use of the highest areal density yet brought to market–an industry-leading 48.8-gigabits per square inch–the new drive confirms Toshiba’s industry leadership in 2.5-inch HDD by delivering a single platter capacity of 30GB.

The new 60GB drive, MK6021GAS, has a superslim 9.5mm high profile, by far the slimmest of any drive offering this capacity. It also incorporates improved signal processing and servo technologies and a high sensitivity GMR head. The new drive can withstand up to 200G of operational shock and 800G of non-operating shock and realizes low noise operation by employing fluid dynamic bearing (FDB) motors. Toshiba will start its mass production in late May.

In this age of information appliances, high-capacity, high performance HDD are essential to support new generations of portable personal equipment. Toshiba is the pioneer in small form-factor HDD, and its range of 2.5-inch HDD offer technical excellence backed up by a rugged design and reliability.

The large capacity of Toshiba’s new drive allows it to handle the most demanding operating systems, applications and files, including large video sources, while its small size suits them for incorporation in a wide range of products. It will bring much higher storage capacities to portable PCs and space-saving servers, and open the way to much more versatile music servers, personal video recorders, set-top boxes and other digital products. It is particularly attractive for audio and video applications, including recording and editing of AV data, and enjoy advantages over 3.5-inch HDD in portability and lower power consumption.

The new drive continues Toshiba’s moves to reinforce respect for the environment and reduce environmental loads through use of lead-free soldering and halogen-free PCB.